SPC5675KFF0MMS2 32bit Microcontrollers MCU 2MFlash 512KSRAM EBI
♠ wehewehe huahana
| Huahana Huahana | Waiwai Hiʻona |
| Mea hana: | NXP |
| Māhele Huahana: | 32-bit Microcontrollers - MCU |
| RoHS: | Nā kikoʻī |
| moʻo: | MPC5675K |
| Kāila kau ʻana: | SMD/SMT |
| Pūʻolo / hihia: | BGA-473 |
| kumu: | e200z7d |
| Ka nui o ka hoʻomanaʻo papahana: | 2 MB |
| Nui ʻikepili RAM: | 512 kB |
| ʻIkepili kaʻaahi laula: | 32 bit |
| Hoʻoholo ADC: | 12 bit |
| Ka nui o ka uaki: | 180 MHz |
| Voltage Hoʻolako - Min: | 1.8 V |
| Voltage Hoʻolako - Max: | 3.3 V |
| Mahana hana liʻiliʻi loa: | - 40 C |
| ʻO ka wela hoʻohana kiʻekiʻe loa: | + 125 C |
| Kupono: | AEC-Q100 |
| Packaging: | pā |
| Analog Supply Voltage: | 3.3 V/5 V |
| Brand: | NXP Semiconductors |
| ʻAno RAM ʻikepili: | SRAM |
| Voltage I/O: | 3.3 V |
| ʻAi ʻoluʻolu: | ʻAe |
| Pūʻina hana: | MPC567xK |
| Huahana: | MCU |
| ʻAno Huahana: | 32-bit Microcontrollers - MCU |
| ʻAno hoʻomanaʻo papahana: | Flash |
| Ka nui o ka waihona hale hana: | 420 |
| Māhele ʻāpana: | Nā Microcontrollers - MCU |
| Nā hola kiaʻi: | ʻO ka manawa kiaʻi |
| Māhele # Aliases: | 935310927557 |
| Huina Weight: | 0.057260 oz |
♠ MPC5675K Microcontroller
ʻO ka microcontroller MPC5675K, kahi hopena SafeAssure, he32-bit embedded controller i hoʻolālā ʻia no ka mea hoʻokele holomuaʻōnaehana kōkua me RADAR, CMOS imaging, LIDARa me nā kani kani ultrasonic, a me ka mana kaʻa kaʻa he 3-phasenā noi e like me nā kaʻa uila hybrid (HEV) makaʻa kaʻa a me ka wela wela kiʻekiʻe noi noi.
He lālā o ka ʻohana MPC5500/5600 o NXP Semiconductor,aia i loko o ka puke E compliant Power Architectureʻenehana ʻenehana me Variable Length Encoding (VLE).ʻO kēiahoʻokō ʻo core me ka Power Architecture i hoʻokomo ʻiawaeʻano, a he 100 pakeneka mea hoʻohana i kūpono me kakumu hoʻonohonoho hoʻonohonoho hoʻonohonoho hoʻonohonoho hoʻonohonoho hoʻonohonoho hoʻonohonoho Power PC™ (UISA).Hāʻawi ia i ka hana ʻōnaehana a hiki i ʻehā mau manawa o kānaMPC5561 mua, ʻoiai e lawe mai ana iā ʻoe i ka hilinaʻi akama'āina o ka 'ike loea Power Architecture.
He hui piha o ka lako lako a me ka lako polokalamuLoaʻa nā mea hana hoʻomohala e kōkua i ka maʻalahi a me ka wikiwikihoʻolālā ʻōnaehana.Loaʻa ke kākoʻo hoʻomohala maialakaʻi i nā mea kūʻai aku e hāʻawi ana i nā compiler, debuggers anā kaiapuni hoʻomohala simulation.
• kiʻekiʻe-hana e200z7d lua kumu
— 32-bit Power Architecture ʻenehana CPU
— A hiki i ka 180 MHz kumu alapinepine
— Koko pili ʻelua
— Hoʻopili ʻia ka lōʻihi like ʻole (VLE)
— Pūnaehana hoʻomanaʻo hoʻomanaʻo (MMU) me nā helu 64
— 16 KB aʻo huna huna a me 16 KB waihona ʻikepili
• Loaʻa ka hoʻomanaʻo
— A hiki i ka 2 MB code flash memory me ECC
— 64 KB memo uila uila me ECC
— A hiki i ka 512 KB ma-chip SRAM me ECC
• SIL3/ASILD manaʻo palekana hou: LockStep mode a me ka palekana-palekana
- ʻĀpana o ka hana hou ʻana (SoR) no nā mea nui
- Nā ʻāpana nānā ʻana i nā ʻāpana o ka SoR i pili iā FCCU
- ʻO ka ʻohi hewa a me ka ʻāpana hoʻokele (FCCU)
- ʻO ka hoʻāʻo ponoʻī i kūkulu ʻia i ka wā boot no ka hoʻomanaʻo (MBIST) a me ka loiloi (LBIST) i hoʻoulu ʻia e ka lako.
- ʻO ka hoʻāʻo ponoʻī i kūkulu ʻia i ka wā boot no ADC a me ka hoʻomanaʻo uila
— Hoʻopili hou ʻia ka manawa kiaʻi palekana i hoʻonui ʻia
— ʻO ka mea ʻike wela o ka mea hoʻoheheʻe silicone (make).
— ʻAʻole-maskable interrupt (NMI)
— 16-ʻāpana hoʻomanaʻo hoʻomanaʻo ʻāpana pale (MPU)
— Nā ʻāpana nānā uaki (CMU)
— ʻĀpana hoʻokele mana (PMU)
— Nā ʻāpana Cyclic redundancy check (CRC).
• Hoʻokaʻawale ʻia ke ʻano Parallel no ka hana kiʻekiʻe o ka hoʻohana ʻana i nā cores replicated
• Pākuʻi Nexus Papa 3+
• Keakea
— Hoʻopili hou ʻia 16-mea hoʻoponopono hoʻopaneʻe
• Hiki i nā GPIO ke hoʻolālā ʻia ma ke ʻano he hoʻokomo, hoʻopuka, a i ʻole hana kūikawā
• 3 mau ʻāpana eTimer kumu nui (6 nā kaha i kēlā me kēia)
• 3 FlexPWM pūʻulu me ʻehā mau kaha 16-bit no kēlā me kēia module
• Nā pilina pili
— 4 LINFlex modules
- 3 mau modula DSPI me ka hana koho chip maʻalahi
— 4 FlexCAN interfaces (2.0B Active) me 32 memo mea
— Module FlexRay (V2.1) me ke kaila lua, a hiki i 128 mau mea memo a hiki i 10 Mbit/s
— Hoʻoponopono ʻo Ethernet wikiwiki (FEC)
— 3 I2C modules
• ʻEhā 12-bit analog-to-digital converters (ADCs)
— 22 mau ala komo
— Programmable cross triggering unit (CTU) e hoʻohui i ka hoʻololi ADC me ka manawa a me ka PWM
• kaʻa kaʻa waho
• 16-bit waho DDR hoʻomanaʻo hoʻoponopono
• Pākuʻi kikohoʻe like (PDI)
• Ma ka chip CAN/UART bootstrap loader
• Hiki ke hana ma kahi lako 3.3 V hoʻokahi
— 3.3 V-wale wale no modules: I/O, oscillators, flash memory
— Nā modules 3.3 V a i ʻole 5 V: ADCs, hoʻolako i VREG kūloko
— 1.8–3.3 V ka laulā lako: DRAM/PDI
• ʻO ka pae wela o ka hui hoʻohana –40 a 150 °C
