Hoʻolālā ʻo SAMSUNG e hoʻopākolu i kona hiki ke loaʻa chip ma 2027

Ua ʻōlelo ʻo Jeong Ki-tae, ka hope pelekikena o ka hoʻomohala ʻenehana no ka hui ʻoihana foundry ʻoihana, ua hana maikaʻi ʻo Samsung Electronics i kahi chip 3-nanometer e pili ana i ka ʻenehana GAA no ka manawa mua ma ka honua i kēia makahiki, me ka 45 pakeneka haʻahaʻa haʻahaʻa, 23 pākēneka kiʻekiʻe o ka hana a me 16 pakeneka ka liʻiliʻi o ka wahi i hoʻohālikelike ʻia me kahi chip 5-nanometer.

Hoʻolālā ʻo Samsung Electronics i ka hoʻonui ʻana i ka mana hana o kāna chip foundry, kahi e manaʻo ai e ʻoi aku ma mua o ka ʻekolu o kona mana hana i ka makahiki 2027. No kēlā hopena, ke ʻimi nei ka chipmaker i kahi hoʻolālā "shell-first", e pili ana i ke kūkulu ʻana i kahi lumi maʻemaʻe ma mua a laila e hana maʻalahi i ka ʻoihana e like me ka piʻi ʻana o ka mākeke.

Ua ʻōlelo ʻo Choi Si-young, ka pelekikena o Samsung Electronics 'foundry business unit, "Ke hana nei mākou i ʻelima mau hale hana ma Korea a me ʻAmelika Hui Pū ʻIa, a ua hoʻopaʻa mākou i nā wahi e kūkulu ai ma mua o 10 mau hale hana."

Ua aʻo ʻo IT House e hoʻolālā ana ʻo Samsung Electronics e hoʻomaka i kāna kaʻina hana 3-nanometer lua i ka makahiki 2023, e hoʻomaka i ka hana nui o 2-nanometer i 2025, a hoʻomaka i kahi kaʻina hana 1.4-nanometer i 2027, kahi palapala alanui ʻenehana i hōʻike mua ʻia e Samsung ma Kapalakiko ma ʻOkakopa 3 (manawa kūloko).