Ua mālama ʻo Samsung Electronics i ka Samsung Foundry Forum 2022 ma Gangnam-gu, Seoul ma ʻOkakopa 20, hōʻike ʻo BusinessKorea.
Ua ʻōlelo ʻo Jeong Ki-tae, ka hope pelekikena o ka hoʻomohala ʻenehana no ka hui ʻoihana hoʻokumu o ka hui, ua hoʻopuka maikaʻi ʻo Samsung Electronics i kahi chip 3-nanometer ma muli o ka ʻenehana GAA no ka manawa mua ma ka honua i kēia makahiki, me 45 pakeneka haʻahaʻa haʻahaʻa. 23 pakeneka kiʻekiʻe o ka hana a me 16 pakeneka ka liʻiliʻi o ka wahi i hoʻohālikelike ʻia me kahi chip 5-nanometer.
Hoʻolālā pū ʻo Samsung Electronics e hoʻokaʻawale i ka hoʻoikaika ʻana e hoʻonui i ka hiki ke hana o kāna ʻupena chip, kahi e manaʻo ai e ʻoi aku ma mua o ka ʻekolu o kāna hana hana ma 2027. No kēlā hopena, ke ʻimi nei ka mea hana chip i kahi papahana "shell-first", e pili ana i ke kūkulu ʻana i kahi lumi hoʻomaʻemaʻe mua a laila e hoʻohana maʻalahi i ka ʻoihana e like me ke koi ʻana o ka mākeke.
Ua ʻōlelo ʻo Choi Si-young, ka pelekikena o Samsung Electronics 'foundry business unit, "Ke hana nei mākou i ʻelima mau hale hana ma Korea a me ʻAmelika Hui Pū ʻIa, a ua hoʻopaʻa mākou i nā wahi e kūkulu ai ma mua o 10 mau hale hana."
Ua aʻo ʻo IT House e hoʻolālā ana ʻo Samsung Electronics e hoʻomaka i kāna kaʻina hana 3-nanometer lua ma 2023, hoʻomaka i ka hana nui o 2-nanometer i 2025, a hoʻomaka i kahi kaʻina hana 1.4-nanometer i 2027, kahi palapala ʻenehana i hōʻike mua ʻia e Samsung ma San. ʻO Francisco ma ʻOkakopa 3 (manawa kūloko).
Ka manawa hoʻouna: Nov-14-2022